High-Bandwidth-Memory-HBM


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HBM shortens your information commute
HBM blasts through existing performance limitations
MOORE’S INSIGHT
High-Bandwidth Memory (HBM)
REINVENTING MEMORY TECHNOLOGY
DRAM
Per Package
32-bit
1024-bit
Up to 1750MHz (7GBps)
Up to 500MHz (1GBps)
Up to 28GB/s per chip
�100GB/s per stack
1.3V
Voltage
IFBGA Roll
DRAM Core die
DRAM Core die
DRAM Core die
DRAM Core die
Substrate
Package
HBM: AMD and JEDEC establish a new industry standard
Industry standards
JEDEC
ICs/PHY
© 2015 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo,and combinations thereof are trademarks of Advanced Micro Devices, Inc.
1. Testing conducted by AMD engineering on the AMD Radeon™ R9 290X GPU vs. an HBM-based device. Data obtained through isolated direct measurement
of GDDR5 and HBM power delivery rails at full memory utilization. Power eciency calculated as GB/s of bandwidth delivered per watt of power consumed.
AMD Radeon™ R9 290X (10.66 GB/s bandwidth per watt) and HBM-based device (35+ GB/s bandwidth per watt), AMD FX-8350, Gigabyte GA-990FX-UD5, 8GB
GDDR5 can’t keep up with GPU performance growth
GDDR5's rising power consumption may soon be
great enough to actively stall the growth of
graphics performance.
DRAM
TRUE
OPTICS
Stacked Memory
CPU/GPU
Silicon Die
Off Chip Memory
10
20
30
40
50
GB/s of Bandwidth Per Watt
Areal, to scale
94% less surface area
24mm
Revolutionary HBM breaks the processing bottleneck
HBM is a new type of memory chip with low power consumption and ultra-wide
communication lanes. It uses vertically stacked memory chips interconnected by microscopic
wires called "through-silicon vias," or TSVs.
HBM DRAM Die
HBM DRAM Die
HBM DRAM Die
HBM DRAM Die
GPU/CPU/Soc Die
Logic Die
Interposer
Package Substrate
Package
Substrate
Interposer
Logic Die
GDDR5 limits form factors
A large number of GDDR5 chips are required to
reach high bandwidth. Larger voltage circuitry is
On-chip integration not ideal for everything
Technologies like NAND, DRAM and Optics would
benet from on-chip integration, but aren't
technologically compatible.
PERFORMANCE
Coming
Soon!
Over the history of computing hardware, the number of transistors in a dense integrated circuit
has doubled approximately every two years.
(Thus) it may prove to be more economical to build large systems out of larger functions, which

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